Markeren: 
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                fully automatic PCB depaneling machine, high precision SMT dicing system, powerful SMT assembly line cutter
                              

Gewicht:	1900 kg	Stroom:	10 kW
Spanning:	220V/110V	Z-as slag:	60 mm
Spindel kracht:	2,4*2 ingestelde kW	Voeding:	3P 220V (50 ~ 60 Hz)
Machinekracht:	8 kW	Luchtdruk:	0,6 ~ 0,68 MPa
Max materiaaldiameter:	300 mm	Herhalingsnauwkeurigheid:	0,001 mm
Snijsnelheid:	0,05 ~ 400 mm/sec	Spilsnelheid:	60,000 t/min
Bladgrootte:	2 inch (maximaal 3 inch)	Framecapaciteit:	20 ~ 30 lagen
Bedrijfstemperatuur:	20 ~ 25℃

Gewicht:	1900 kg
Stroom:	10 kW
Spanning:	220V/110V
Z-as slag:	60 mm
Spindel kracht:	2,4*2 ingestelde kW
Voeding:	3P 220V (50 ~ 60 Hz)
Machinekracht:	8 kW
Luchtdruk:	0,6 ~ 0,68 MPa
Max materiaaldiameter:	300 mm
Herhalingsnauwkeurigheid:	0,001 mm
Snijsnelheid:	0,05 ~ 400 mm/sec
Spilsnelheid:	60,000 t/min
Bladgrootte:	2 inch (maximaal 3 inch)
Framecapaciteit:	20 ~ 30 lagen
Bedrijfstemperatuur:	20 ~ 25℃

High Precision Fully Automatic Powerful Dicing System for SMT Assembly Line

The dicing system utilizes a specialized slim blade mounted on the spindle head to perform precision cutting operations. Through high-speed spindle rotation, it accurately cuts materials including glass, ceramic, semiconductor chips, PCB boards, EMC wire frames, and various other substrates.

Operation Procedures

Wafer or Strip

Tape Mounting

Dicing

Cleaning

UV Separation

Automated Dicing System Description

The auto-dicing system performs complete automated operations through a comprehensive process sequence including feeding, position calibration, cutting, cleaning/drying, and unloading.

Feeding Automatically

Position Alignment

Auto-Dicing

Cleaning/Drying

Unloading Automatically

Automatically removes dicing material from magazine and transfers to working platform
Performs automatic dicing position alignment
Completes the entire dicing process automatically
Utilizes pure water and compressed air for cleaning and drying
Automatically returns processed material to magazine

Applications

The automatic dicing system is widely used for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCB boards, IR filters, sapphire glass, and ceramic thin plates.

Ceramic Substrate

Silicon Rubber

Lead Frame

Silicon Wafer

PCB

Glass

Operating Requirements

Clean compressed air with atmospheric pressure dew point of -10°C to -20°C, residual oil content of 0.1ppm, and filtration accuracy above 0.01μm/99.5%
Operating environment temperature: 20°C to 25°C with fluctuation control within ±1°C
Cutting water temperature: 22°C to 27°C (variation within ±1°C)
Cooling water temperature: 20°C to 25°C (variation within ±1°C)
Installation away from external vibrations, impact sources, high-temperature devices like blowers, and oil mist generators
Strict adherence to provided product manual for operation

Full Auto Dicing System YS-2000AD Product Features

Control Interface	Touch LCD with simple, intuitive design supporting multiple languages (Chinese, English, Korean)
Automation	Fully automated feeding, position alignment, cutting, cleaning/drying, and unloading
Maximum Capacity	High precision cutting for materials up to 300mm diameter
Cutting Efficiency	Double spindle simultaneous cutting with over 85% higher capacity than single spindle systems
Alignment System	CCD automatic alignment
Monitoring System	Real-time pressure, water pressure, and current monitoring to prevent air spindle damage
Dicing Spindle	2.4 kW × 2 sets (Maximum: 60,000 RPM)
Positioning Accuracy	Repeat positioning accuracy: 0.001mm
Cutting Speed	0.05 to 400 mm/sec
Magazine Capacity	20 to 30 layers of frame storage per magazine
Blade Size	Standard: 2 Inch (Maximum: 3 Inch)

Process Description

Mechanism removes material from magazine and transfers to temporary table
Unloading robot moves dicing material to chuck for dicing process
Feeding robot transfers dicing material to cleaning platform for cleaning and drying
Unloading robot sends cleaned and dried material to temporary table
Robot returns processed dicing material to magazine